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N25Q512A13GSF40G |
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表面贴装 |
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SOP |
512Mbit |
SPI |
16 |
4M x 128 位 |
NOR |
2.7 V |
3.6 V |
对称 |
4M |
5ns |
128Bit |
10.3 x 7.5 x 2.5mm |
7.5mm |
-40 °C |
85 °C |
10.3mm |
2.5mm |
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MT48LC16M16A2P-6A:G |
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易失 |
DRAM |
SDRAM |
256Mb (16M x 16) |
12ns |
5.4ns |
并联 |
3 V ~ 3.6 V |
0°C ~ 70°C(TA) |
表面贴装 |
54-TSOP(0.400",10.16mm 宽) |
54-TSOP II |
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符合限制有害物质指令(RoHS)规范要求 |
4 周 |
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MT16VDDF6464HG-40BG2 |
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DDR SDRAM |
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512MB |
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含铅/不符合限制有害物质指令(RoHS)规范要求 |
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400MT/s |
200-SODIMM |
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M25P40-VMP6GB |
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非易失 |
闪存 |
FLASH - NOR |
4Mb (512K x 8) |
15ms,5ms |
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SPI |
2.3 V ~ 3.6 V |
-40°C ~ 85°C(TA) |
表面贴装 |
8-VDFN 裸露焊盘 |
8-VFDFPN(6x5) |
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符合限制有害物质指令(RoHS)规范要求 |
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MT4HTF1664AY-667B1 |
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DDR2 SDRAM |
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128MB |
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符合限制有害物质指令(RoHS)规范要求 |
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667MT/s |
240-UDIMM |
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MT36HTJ51272Y-40EA2 |
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DDR2 SDRAM |
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4GB |
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符合限制有害物质指令(RoHS)规范要求 |
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400MT/s |
240-RDIMM |
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JR28F064M29EWLA |
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表面贴装 |
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TSOP |
64Mbit |
并行 |
48 |
4M x 16 位,8M x 8 位 |
NOR |
2.7 V |
3.6 V |
对称 |
4M, 8M |
70ns |
8/16Bit |
18.4 x 12 x 1mm |
12mm |
-40 °C |
85 °C |
18.4mm |
1mm |
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MT29F32G08CBADAWP:D TR |
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非易失 |
闪存 |
FLASH - NAND |
32Gb (4G x 8) |
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并联 |
2.7 V ~ 3.6 V |
0°C ~ 70°C(TA) |
表面贴装 |
48-TFSOP(0.724",18.40mm 宽) |
48-TSOP |
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符合限制有害物质指令(RoHS)规范要求 |
4 周 |
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MT18HTF12872Y-40EB3 |
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DDR2 SDRAM |
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1GB |
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符合限制有害物质指令(RoHS)规范要求 |
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400MT/s |
240-RDIMM |
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MT9VDDT6472HG-40BD2 |
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DDR SDRAM |
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含铅/不符合限制有害物质指令(RoHS)规范要求 |
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200MHz |
200-SODIMM |
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MT8HTF12864HY-40EA3 |
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DDR2 SDRAM |
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1GB |
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符合限制有害物质指令(RoHS)规范要求 |
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400MT/s |
200-SODIMM |
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MT29F2G16ABAEAWP:E |
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非易失 |
闪存 |
FLASH - NAND |
2Gb (128M x 16) |
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并联 |
2.7 V ~ 3.6 V |
0°C ~ 70°C(TA) |
表面贴装 |
48-TFSOP(0.724",18.40mm 宽) |
48-TSOP I |
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符合限制有害物质指令(RoHS)规范要求 |
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MT16HTF25664AY-40EA1 |
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DDR2 SDRAM |
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2GB |
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符合限制有害物质指令(RoHS)规范要求 |
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400MT/s |
240-UDIMM |
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MT29F1G08ABBFAH4-ITE:F TR |
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非易失 |
闪存 |
FLASH - NAND |
1Gb (128M x 8) |
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并联 |
1.7 V ~ 1.95 V |
-40°C ~ 85°C(TA) |
表面贴装 |
63-VFBGA |
63-VFBGA(9x11) |
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符合限制有害物质指令(RoHS)规范要求 |
5 周 |
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MT4LSDT464HG-133G4 |
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SDRAM |
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32MB |
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含铅/不符合限制有害物质指令(RoHS)规范要求 |
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133MHz |
144-SODIMM |
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MT46V128M4TG-6T:D TR |
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易失 |
DRAM |
SDRAM - DDR |
512Mb (128M x 4) |
15ns |
700ps |
并联 |
2.3 V ~ 2.7 V |
0°C ~ 70°C(TA) |
表面贴装 |
66-TSSOP(0.400",10.16mm 宽) |
66-TSOP |
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含铅/不符合限制有害物质指令(RoHS)规范要求 |
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MT9HTF6472AY-667B3 |
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DDR2 SDRAM |
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512MB |
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符合限制有害物质指令(RoHS)规范要求 |
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667MT/s |
240-UDIMM |
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N25Q032A11EF640E |
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表面贴装 |
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MLP |
32Mbit |
SPI |
8 |
4M x 8 位 |
NOR |
1.7 V |
2 V |
对称 |
4M |
5ns |
8Bit |
6 x 5 x 0.85mm |
5mm |
-40 °C |
85 °C |
6mm |
0.85mm |
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MT29F8G08ABABAWP:B TR |
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非易失 |
闪存 |
FLASH - NAND |
8Gb (1G x 8) |
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并联 |
2.7 V ~ 3.6 V |
0°C ~ 70°C(TA) |
表面贴装 |
48-TFSOP(0.724",18.40mm 宽) |
48-TSOP I |
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符合限制有害物质指令(RoHS)规范要求 |
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MT4VDDT1664HG-335F3 |
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DDR SDRAM |
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128MB |
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含铅/不符合限制有害物质指令(RoHS)规范要求 |
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333MT/s |
200-SODIMM |
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